Openair-Plasma® in Semiconductor Packaging
Semiconductor packaging is a critical step in semiconductor manufacturing, ensuring optimal performance, reliable interconnections, effective chip protection, and efficient heat dissipation. However, surface contaminants such as organic residues and oxide layers can severely compromise bonding quality and electrical reliability. Additionally, the use of electronic devices in harsh environments can degrade IC chip performance over time.
Openair-Plasma® technology addresses these challenges with precise surface cleaning and activation, reduction of oxide layers, and the application of anti-corrosion or adhesion-promoting nano-coatings. These processes enhance surface properties, improve interconnection reliability, and contribute to higher manufacturing yields.
Wire Bonding
Why Plasma Before Wire Bonding?
Wire bonding performance depends heavily on surface cleanliness and activation. Contaminants such as oxides or organic residues can lead to non-stick on pad (NSOP), weak shear strength, or early failure.
Plasma treatment ensures:
- Removal of contaminants that block proper adhesion
- Activation of the bond pad surface for stronger wire grip
- Reduction in weak joints, bond lifts, and rework
- Improved electrical and mechanical stability of the bond
- Higher yield through consistent and repeatable bonding results
Plasma is not optional — it’s the critical step that makes wire bonding clean, strong, and reliable.
Die Bonding
Why Plasma Before Die Attach?
Inconsistent bonding and voids during die attach can compromise performance. Openair-Plasma® prepares both the die and the substrate by removing surface residues and activating material surfaces — inline, without vacuum or chemicals.
Key benefits:
- Clean removal of organic contamination and oxides
- Improved adhesion for adhesives, epoxies, or solders
- Enhanced wettability that reduces voids and delamination
- Reliable performance under thermal and mechanical stress
- Higher process yield and consistent bond quality
Plasma ensures every die bonds cleanly, strongly, and reliably.
Lead Frame - Oxide Reduction
Oxide layers on metal lead frames can inhibit strong interconnections in devices such as CPUs or power modules. Openair-Plasma® with the REDOX®-Tool enables dry, inline oxide reduction directly in the production flow — without vacuum or batch processes.
Benefits include:
- Improved bonding quality
- Higher production yield
- Consistent and repeatable treatment results
The REDOX®-Tool
Oxide Reduction on Leadframe with The REDOX®-Tool
Thermo-Compression Bonding (TCB)
Applying plasma before fluxing creates uniform surface energy and optimal wetting behavior. This allows for a significant reduction in flux use, improves bond formation, and contributes to higher device reliability.
Fluxless Thermo Compressin Bonding (TCB)
In fluxless TCB processes, metal oxides can prevent reliable interconnection. The REDOX®-Tool enables inline plasma-based oxide reduction, creating clean metal surfaces for robust bonding performance. This dry process eliminates the need for flux and supports both higher process reliability and environmentally friendly manufacturing.
Activation Before Underfill
A high and uniform surface energy is essential for the wettability of underfill materials. Openair-Plasma® activates substrate surfaces inline, improving underfill flow and adhesion. It also ensures clean, consistent fillet formation and removes contaminants from the dicing process. The result: fewer voids and more reliable encapsulation.
Barrier Coatings in IC Packaging
Sensitive semiconductor devices require protection from moisture and contamination. PlasmaPlus® enables the atmospheric deposition of ultra-thin barrier coatings (typically 700 to 1,000 nm, depending on application) to protect IC packages.
Benefits of barrier coatings include:
- Moisture resistance to prevent water ingress and circuit damage
- Blocking of ion migration and contamination
- Long-term electrical reliability and insulation stability
- Thermal and mechanical durability under operational stress
These coatings safeguard the internal environment of the package and ensure the long-term stability of sensitive IC components.
Nano Coatings for EMC Adhesion
Nano-scale plasma coatings improve adhesion between epoxy mold compounds (EMCs) and substrates or dies. The result is stronger bonds and improved performance during thermal cycling or mechanical stress.
Advantages include:
- Stronger bonding interfaces for encapsulation
- Resistance to delamination and cracking
- Higher package reliability across thermal and mechanical loads
- Fewer defects and improved production output
Nano coatings create optimized surfaces that ensure stable, durable encapsulation.
KEY FEATURES OF
OPENAIR-PLASMA®
in Semiconductor Packaging
- Selective treatment – Precisely targets critical areas such as bond pads, lead frames, or die surfaces
- High processing speed – Enables inline treatment at up to 1.5 m/sec for high-throughput packaging lines
- Potential-free operation – Less than 1 V output, safe for use on sensitive semiconductor devices and interconnects
- Cost efficiency – Low capital investment and minimal operating costs for scalable deployment
- Surface flexibility – Effective on flat, contoured, and 3D packaging geometries
- Environmentally responsible – VOC-free, solvent-free plasma treatment using only compressed air under atmospheric conditions
