Introducing our new low pressure plasma portfolio

Discover how the new AURORA product series expands the Plasmatreat technology portfolio with uniform full-surface cleaning and activation under defined vacuum conditions, scalable from trials to high volume manufacturing. 

When full-surface preparation must be stable, uniform and reproducible, low pressure plasma is a strong option. It enables controlled cleaning and activation as a reliable basis for downstream steps such as bonding, sealing or further processing.  

In this PlasmaTalk, you will get a practical overview of low pressure plasma for industrial materials processing, focused on production relevance: controllable process chemistry, repeatability, and robust process transfer into manufacturing. 

Why low pressure plasma 

Low pressure plasma runs under defined process conditions inside a vacuum chamber. Process gases can be dosed in a controlled way, supporting repeatable results with less influence from ambient air. This is particularly valuable for complex geometries, sensitive surfaces, and uniform full-surface treatment requirements.  

AURORA: One platform offering flexible plasma interaction

AURORA is designed to adapt plasma-surface interaction to different materials and geometries. One key element is its flexible reactor concept, enabling multiple plasma configurations within the same platform:

• Direct microwave plasma: strong activation with direct plasma contact
• Remote plasma: plasma generation separated from the treatment zone for radical-dominated processes with reduced ion impact
• Downstream plasma: reactive species transported into the treatment area, beneficial for sensitive materials, narrow structures, and complex geometries

This flexibility expands the process window and supports application-specific tuning of plasma chemistry and surface interaction.

Multi-Frequency capability: Combining GHz and MHz

Another core capability of AURORA is the combination of microwave plasma (GHz) and RF plasma (MHz) within one system.

Microwave plasma at 2.45 GHz generates a high-density plasma with a high concentration of reactive radicals. This supports efficient chemical surface modification, cleaning, and activation with relatively low ion energy. RF plasma in the MHz range provides additional control over ion energy and surface interaction, enabling targeted physical activation or enhanced surface reactions.

By combining both frequency regimes, processes can be tuned to balance chemical reactivity and ion-driven effects. This broadens the accessible process window and supports optimization for different materials and industrial requirements.

For industry, this means: process flexibility for different materials and geometries, improved stability and reproducibility, and the ability to tailor chemistry and ion interaction to the surface task.

How AURORA and Openair-Plasma^® complement each other 

Openair-Plasma^® is ideal for local, selective and inline pretreatment at atmospheric pressure, especially when cycle time and integration into existing production lines are key. AURORA uses low pressure plasma in a vacuum chamber and is designed for uniform full-surface treatment under defined conditions, for example when geometries are complex or surfaces are sensitive. In many manufacturing setups, the best approach is not either-or, but choosing the right tool for the specific surface task. 

What the PlasmaTalk covers 

We focus on two capabilities of AURORA: 

• Cleaning: removal of organic residues and process contamination for consistent downstream processing
• Activation: improved wetting and adhesion, and what it takes to stabilize recipes for production 

Industries and application examples 

You will see how these capabilities translate into real manufacturing needs, including semiconductor (frontend and backend), medical devices, aerospace and automotive, textiles and membranes, and microfluidics.